NOTE: Please apply through LinkedIn or email your resume to:
resumes@analogphotonics.com
Analog Photonics is a Boston based high technology company developing chip-scale LiDAR for automotive, robotic and mobile device applications as well as high-speed datacom modules for datacenters. We are engaging with customers worldwide in growing markets such as automotive and datacenter interconnects.
Job Description
We are currently looking for a Packaging Engineer to join the hardware team at Analog Photonics. In this role, you will work with a cross-functional team of IC design engineers, product engineers, quality engineers, and foundries to develop robust product packaging solutions. Tasks will include the packaging design multi-chip modules containing photonic integrated circuits (PICs), CMOS ASICs, and 2.5D integrated lasers. This is a great opportunity for anyone with the requisite background who wants to gain experience in product design, prototyping, and manufacturing. Excellent oral and written communication skills are required to communicate ideas with foundry customers, colleagues, and management.
Key Responsibilities
• Develop robust high volume manufacturable post-fab assembly processes
• Run thermal simulations and design thermal solutions
• Work with foundries and contract manufacturers at different assembly steps to improve cycle time, quality, and yield
• Work with IC packaging vendors in designing package for 2.5D and 3D packaging devices
• Work with PCB designers and design wirebonding diagrams
• Work with laser designers for optical packaging
• Visit local partners for packaging related activities
• Qualification requirements definition & management (AEC-Q)
Required Qualifications
• B.S. (M.S. preferred) in materials science, mechanical engineering, electrical engineering, physics, or related field
• 4+ years of related experience in microelectronics and/or photonics packaging
• Strong understanding of existing and advanced packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
• In-depth knowledge of thermal-mechanical interactions, packaging & assembly process flows and material selection
• Experience in solder, epoxy processes, low thermal resistance interfaces, thermal fatigue of interfaces and wire bonding intermetallic growth mechanisms
• Good understanding of JEDEC methodology for component level and board level reliability qualification requirements
• Familiarity of package related design/simulation software and ability to analyze simulation results.
• Clear problem-solving capability, data-driven, inventive solution-oriented and can articulate thought processes.
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